SEMICONDUCTOR STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Sep 29, 2016
app pub date -
Sep 16, 2015
filing date -
Sep 16, 2015
priority date (Note) -
Abandoned
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Abstract
The present disclosure relates to a semiconductor structure, which includes a semiconductor substrate, an insulating layer and a plurality of wirings. The insulating layer is disposed on the semiconductor substrate. The plurality of wirings are disposed between the semiconductor substrate and the insulating layer. At least one wiring of the wirings includes a plurality of holes, and a total area of the holes is from 10% to 70% of a surface area of the at least one wiring.
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