ELECTRONIC COMPONENT PACKAGE
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United States of America Patent
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Issued Date -
Sep 29, 2016
app pub date -
Oct 20, 2014
filing date -
Nov 8, 2013
priority date (Note) -
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Abstract
Provided is a rational arrangement of an electronic component package that tightly keeps a connecting state of a lead member to a conductive pad of a substrate. The electronic component package includes a substrate having a conductive pad and mounting an electronic component, a lead member electrically conducted to the conductive pad, and a molded portion in which the above members are embedded. The lead member includes an inner conductor having bifurcated end portions and a unitary portion formed integral therewith. The inner conductor and a part of the unitary portion which are embedded in the molded portion are curved in protrusive or sunken manner relative to an imaginary plane extending along the surface of the substrate.
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