CHIP PRESS DEVICE AND CHIP PRESS METHOD

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United States of America Patent

SERIAL NO

14801222

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Abstract

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A chip press device and a chip press method are disclosed. The chip press device includes a base, a hot pressing head and a buffer, and a bearing surface of the base is a convex surface. The bearing surface of the base being a convex surface allows a display panel to deform slightly downwards during the chip pressing process. When the chip press is finished, the display panel deforms upwards under the shrinkage of the chip. Since the upwards deformation amount counteracts the downwards deformation amount, the warpage of display panel in conventional chip pressing process can be eliminated, which further avoids uneven uneven chromatic aberration in displayed images and improves the product quality.

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Patent Owner(s)

Patent OwnerAddress
BOE TECHNOLOGY GROUP CO LTD100015 NO 10 JIUXIANQIAO ROAD BEIJING CHAOYANG DISTRICT BEIJING CITY BEIJING CITY 100015
BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO LTDNO 5 WEST SIDE JINGKAI RD GU'AN INDUSTRIAL PARK GU'AN HEBEI 065500

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
XIA, Yelei Beijing, CN 3 10
ZHANG, Yongming Beijing, CN 37 231

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