Method of manufacturing a printed circuit and the corresponding printed circuit
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United States of America Patent
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Issued Date -
Sep 22, 2016
app pub date -
Mar 18, 2016
filing date -
Mar 18, 2016
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Abstract
The manufacturing method gives the possibility of manufacturing a printed circuit comprising an electrically insulating substrate and electrically conductive elements borne by the substrate. The manufacturing method comprises the manufacturing of the insulating substrate and of the conductive elements together by additive manufacturing.
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