Wire harness, method of connecting terminal and coated wire, and mold

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9853367
APP PUB NO 20160276754A1
SERIAL NO

15033462

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Abstract

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The height (F) of a protruding portion (7) is less than the thickness of a crimping portion (5) before crimping. If the height of the protruding portion (7) is greater than the thickness of the crimping portion, then a recess is prone to form in the inner surface of the crimping portion (5). In other words, because there is more metal flowing outwards, a recess corresponding to the metal flow is prone to form on the inner surface side. If such a recess does form, adhesion with a covered area (27) is likely to deteriorate. This is problematic because such a gap would be a path allowing the ingress of moisture. On the other hand, if the height of the protruding portion (7) is less than the thickness of the crimping portion (5) before crimping, then when the crimping portion (5) is compressed during crimping, the amount of metal flowing towards the protruding portion (7) diminishes, making it possible to suppress the formation of a receding portion on the inner surface of the crimping portion (5).

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Patent Owner(s)

Patent OwnerAddress
TOYOTA JIDOSHA KABUSHIKI KAISHA1 TOYOTA-CHO TOYOTA-SHI AICHI-KEN 471-8571
FURUKAWA ELECTRIC CO LTDJAPAN TOKYO CHIYODA TOKYO TOKYO METROPOLIS
FURUKAWA AUTOMOTIVE SYSTEMS INC1000 AMAGO KOURA-CHO INUKAMI-GUN SHIGA 5220242

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawamura, Yukihiro Inukami-gun, JP 75 581
Kihara, Yasushi Tokyo, JP 19 123
Kobayashi, Hiroshi Okazaki, JP 902 9719
Nakashima, Takahito Okazaki, JP 24 124
Taga, Hiroyasu Toyota, JP 15 68
Tonoike, Takashi Inukami-gun, JP 27 182

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