LIGHT EMITTING DIODE HAVING MULTILAYER BONDING PAD
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United States of America Patent
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Issued Date -
Sep 22, 2016
app pub date -
Dec 16, 2014
filing date -
Dec 6, 2013
priority date (Note) -
Abandoned
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Abstract
A light-emitting diode having a multilayer bonding pad includes: a P1 layer disposed under a light-emitting structure and configured to improve ohmic contact and adhesion; a P3 layer disposed under the P1 layer and configured to prevent diffusion; a Sn-based metal layer disposed under the P1 layer and configured to enhance soldering weldability and prevent oxidation; a Cu-based P5 layer disposed on the Sn-based metal layer and configured to prevent the diffusion of Sn; and a P4 layer disposed between the P3 layer and the P5 layer and configured to suppress the reaction between the P5 layer and other layers.
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