SEMICONDUCTOR ASSEMBLY AND METHOD TO FORM THE SAME

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United States of America Patent

APP PUB NO 20160276254A1
SERIAL NO

15071761

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor assembly is disclosed where the semiconductor assembly includes a shell with an opening, an island that shuts the opening, and terminals. The island and the terminals are originally secured by and connected to an outer support, and formed by cutting or etching a metal plate constituting a lead frame. The heat sink, which may be formed independent of the lead frame, is attached to a back surface of the island; while, a top surface of the island mounts the semiconductor element thereon. Heat generated by the semiconductor element is effectively dissipated to the heat sink through the island.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC DEVICE INNOVATIONS INC1 KANAI-CHO SAKAE-KU YOKOHAMA-SHI KANAGAWA 244-0845

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MAEKAWA, Arata Nakakoma-gun, JP 1 0

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