ACTIVE-OPTICAL IC-PACKAGE SOCKET
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United States of America Patent
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app pub date -
Mar 16, 2016
filing date -
Mar 17, 2015
priority date (Note) -
Abandoned
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Abstract
A socket for an IC package includes a base with which the IC package is capable of being mated and unmated and an optical element integrated with the base. When the IC package is mated with the base, based on electrical signals received from the IC package, the optical element generates light signals or modifies light signals; and/or based on detected light signals, the socket generates electrical signals that are transmitted to the IC package.
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