ELECTROLESS COPPER PLATING SOLUTION
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United States of America Patent
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Issued Date -
Sep 22, 2016
app pub date -
Mar 25, 2014
filing date -
Mar 27, 2013
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Abstract
The invention relates to an electroless aqueous copper plating solution, comprising
- a source of copper ions,a reducing agent or a source of a reducing agent, anda combination comprisingi) N,N,N′,N′-Tetrakis (2-hydroxypropyl)ethylenediamine or a salt thereof, andii) N′-(2-Hydroxyethyl)-ethylenediamine-N,N,N′-triacetic acid or a salt thereof, as complexing agents,as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.
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