CUTTING DEVICE, CUTTING EQUIPMENT AND METHOD

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United States of America Patent

APP PUB NO 20160271733A1
SERIAL NO

15014493

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A cutting device for creating an object from material is described. The cutting device comprises: a plurality of image sensors separated by a predetermined distance and the image sensors being operable to capture a stereoscopic view of the material; controller circuitry operable to determine the position of the cutting device relative to the material using the captured stereoscopic view of the material; drive control circuitry, under control of the controller circuitry, operable to control the movement of the cutting device relative to the material; and a cutting unit, under control of the controller circuitry, operable to cut the material.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATIONTOKYO
SONY EUROPE LIMITEDBROOKLANDS WEYBRIDGE SURREY KT13 0XW

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AVITABILE, Antonio Bentley, GB 12 58
Ferrari, Roberta Basingstoke, GB 1 1

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