Feedthrough of an Implantable Electronic Medical Device and Implantable Electronic Medical Device
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United States of America Patent
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Issued Date -
Sep 22, 2016
app pub date -
Feb 26, 2016
filing date -
Feb 26, 2016
priority date (Note) -
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Abstract
A feedthrough of an implantable electronic medical device, including a housing, an insulating body, a feedthrough flange surrounding the insulating body, and at least one connecting element penetrating the insulating body for externally connecting an electric or electronic component of the device, in particular multiple connecting elements, wherein a low-temperature hard solder connection or soft solder connection is provided between the insulating body and the feedthrough flange and/or between the insulating body and the, or at least one, connecting element and/or between the insulating body and the housing, the connection being formed in particular at a temperature of 900° C. or less, preferably less than 450° C., and still more preferably less than 400° C.
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