Copper Interconnect Device Including Surface Functionalized Graphene Capping Layer and Fabrication Method Thereof
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United States of America Patent
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Issued Date -
Sep 15, 2016
app pub date -
Mar 7, 2016
filing date -
Mar 10, 2015
priority date (Note) -
Abandoned
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Abstract
Disclosed is a copper interconnection device including a surface-functionalized graphene capping layer and a method of fabricating the same, wherein electromigration of a fine copper interconnection can be suppressed by the capping layer having a thickness of ones of nm or less. Specifically, graphene is surface-functionalized to possess functional groups able to chemically interact with copper atoms and is thus used as the capping layer, whereby it is difficult to move the copper atoms through the chemical interaction with the functional groups by the use of only the capping layer as thin as ones of nm or less, effectively suppressing electromigration of the copper interconnection.
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