SEMICONDUCTOR APPARATUS HAVING HEAT DISSIPATING FUNCTION AND ELECTRONIC EQUIPMENT COMPRISING SAME

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United States of America Patent

APP PUB NO 20160268373A1
SERIAL NO

15030347

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Abstract

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A semiconductor apparatus having a heat dissipating function and electronic equipment comprising the same includes a front surface on which semiconductor devices constituting a circuit a circuit are formed; and a rear surface including a convexo-concave surface. Thus, the heat dissipation effect of the semiconductor apparatus can be maximized even without attaching a heat dissipation plate thereto.

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Patent Owner(s)

Patent OwnerAddress
SILICONFILE TECHNOLOGIES INCSEOCHO-GU SEOUL 137-130

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AHN, Heui Gyun Gyeonggi-do, KR 14 51
AHN, Sang Wook Gyeonggi-do, KR 13 260
CHO, Gab Hwan Gyeonggi-do, KR 11 18
JUNG, Huy Chan Gyeonggi-do, KR 8 248
KO, Min Suk Gyeonggi-do, KR 10 20
LEE, Yong Woon Gyeonggi-do, KR 14 266
PARK, Kyoung Sik Gyeonggi-do, KR 4 6

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