Method for Manufacturing Electronic Component
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United States of America Patent
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Issued Date -
Sep 15, 2016
app pub date -
Oct 22, 2014
filing date -
Oct 30, 2013
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Abstract
A method for manufacturing an electronic component having a flexible structure includes the steps of: forming an integrated circuit element package having a foldable and expandable flexible structure, the integrated circuit element package including a first substrate having a foldable and expandable, flexible structure and having a structure on which a heat transfer part capable of transferring heat is patterned, an integrated circuit element having a foldable and expandable, flexible structure and having a first pad of which one surface is electrically connectable, and an adhesive film having a foldable and expandable, flexible structure, which is disposed between the substrate and the integrated circuit element so that the substrate and the integrated circuit element can be adhered to each other; forming a second substrate having a foldable and expandable, flexible structure and having a second pad of which one surface is electrically connectable; and performing a thermo-compression process so as to adhere the integrated circuit element package to the second substrate while electrically connecting the first pad of the integrated circuit element with the second pad of the second substrate through surface contact.
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