Electrodeposited copper foil, and electrical component and battery comprising same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 16, 2020
Grant Date -
Sep 8, 2016
app pub date -
Nov 10, 2014
filing date -
Nov 8, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is an electrodeposited copper foil, in which a center line roughness average Ra (μm), a maximum height Rmax (μm), and a ten-point height average Rz (μm) of a matte side satisfy an Equation below, 1.5≤(Rmax−Rz)/Ra≤6.5. The electrodeposited copper foil according to the present invention maintains low roughness and high strength, and exhibits a high elongation rate, and particularly, has excellent glossiness, so that the electrodeposited copper foil may be used in a current collector of a medium and large lithigum ion secondary battery and a semiconductor packaging substrate for Tape Automated Bonding (TAB) used in a Tape Carrier Package (TCP).
First Claim
Other Claims data not available
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International Classification(s)
- 2014 Application Filing Year
- H01M Class
- 4927 Applications Filed
- 4171 Patents Issued To-Date
- 84.66 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01M Class
- 0 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 16, 2027 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 16, 2031 |
