Semiconductor device for preventing crack in pad region and fabricating method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 28, 2020
Grant Date -
Sep 8, 2016
app pub date -
May 12, 2016
filing date -
May 10, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Calculated Rating
|
US Family Size
|
Non-US Coverage
|
Abstract
A semiconductor device which prevents a crack from occurring on a pad region is provided. The semiconductor device includes a lower pad, an upper pad which is formed above the lower pad, an insulation layer which is formed between the lower pad and the upper pad, a via net for electrically connecting the lower pad and the upper pad in the insulation layer, the via net having a net shape in which a unit grid is connected with its adjacent unit grids to form a net structure, and at least one via hole for electrically connecting the lower pad and the upper pad in the unit grid of the via net.
First Claim
Other Claims data not available
Family
+
−
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| KR | B1 | KR101184375 | May 10, 2010 |
| US | B2 | US9373591 | Nov 02, 2010 |
| CN | A | CN102244059 | Nov 30, 2010 |
| CN | A | CN105428336 | Nov 30, 2010 |
International Classification(s)
- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 7 Citation Count
- H01L Class
- 41.95 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 28, 2027 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 28, 2031 |
