SPUTTERING TARGET AND METHOD OF PRODUCING SPUTTERING TARGET
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United States of America Patent
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Sep 8, 2016
app pub date -
Apr 16, 2015
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Apr 17, 2014
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A sputtering target of the present invention is a sintered body containing: 0.5 at % to 10 at % of at least one metal element selected from Ni and Al; 0.01 ppm by weight to 10000 ppm by weight of B or P; and a balance including Si and inevitable impurities, in which the sintered body has a volume resistivity of 10 Ω·cm or lower, a theoretical density ratio of 85% to 99%, and a bending strength of 65 N/mm2 or higher.
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