HEAT DISSIPATION MODULE
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United States of America Patent
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Issued Date -
Sep 8, 2016
app pub date -
Jun 3, 2015
filing date -
Mar 6, 2015
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Abstract
A heat dissipation module including an evaporator, a copper tube communicated with the evaporator to construct a loop, and a heat-transmitting medium flowing in the loop is provided. The evaporator includes an upper cover and a lower cover connected with each other and constructing a cavity. The lower cover has a heat-isolating wall protruded toward the cavity, so as to separate a heat-isolating region and a heating region at the lower cover. The upper cover has a slope inclining toward the cavity. A heat of an electronic element is transmitted to the heat-transmitting medium through the heating region, so that the heat-transmitting medium flows out of the evaporator towards a single direction along the slope after absorbing the heat, flows in the copper tube to transmit the heat outward through the copper tube, and then flows back to the evaporator through the copper tube after dissipating the heat.
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