METHOD AND DEVICE FOR MACHINING A SUBSTRATE
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United States of America Patent
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Sep 8, 2016
app pub date -
Dec 4, 2014
filing date -
Jan 13, 2014
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Abstract
A method for machining a flat substrate having at least one layer passes the substrate in the form of a strip, web or sheet through at least one machining tool together with a strip-like, web-like or sheet-like filler material on different levels; the substrate is positioned and held, more particularly in the vicinity of the machining tool; at least one punch-type component of the machining tool creates an opening, more particularly a window, at a predeterminable point on the substrate; the component is then moved to an area outside the opening; and in another stroke an element that matches the cross-section of the opening is punched out of the filler material by the component of the machining tool, is moved by the component towards the opening in the clamped substrate, and is placed by the component in the opening in the substrate.
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