FLUX-LESS DIRECT SOLDERING BY ULTRASONIC SURFACE ACTIVATION
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Oct 21, 2014
filing date -
Oct 22, 2013
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A solder joint and a method of making the same is described. The solder joint includes, a first metal part; a second metal part; and solder material disposed between the first and second metal parts; such that the solder material forms a joint with the first and second metal parts; and the solder material has a plurality of abrasive particles disposed therein. The method includes contacting the solder material with the abrasive particles; placing the solder material and the abrasive particles between the first and second metal parts to form a layered structure; applying a compressive force on the layered structure; applying ultrasonic vibration for a predetermined time to the layered structure to remove the passive oxide layer of the metal part; and applying heat to the layered structure to cause the solder material to melt and flow between the metal parts and form a bond with the metal parts.
First Claim
Other Claims data not available