AN EPOXY RESIN COMPOSITION, AND PREPREG AND COPPER-CLAD LAMINATE MADE BY USING SAME

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United States of America Patent

APP PUB NO 20160255718A1
SERIAL NO

14407632

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Abstract

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The present invention related to an resin compound, especially to an epoxy resin composition and a prepreg and a copper-clad laminate made by using same. The epoxy resin composition of the present invention employs ester compound and flexible amine hardener to cure the epoxy resin, and the resin composition possesses excellent dielectric properties as well as high glass transition temperature and good toughness. The epoxy resin composition of the present invention, which applied in a prepreg and a copper-clad laminate, possesses excellent dielectric properties, high glass transition temperature and good impact toughness.

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Patent Owner(s)

Patent OwnerAddress
SHENGYI TECHNOLOGY CO LTDNO 5 GONGYE WEST ROAD SONGSHAN LAKE PARK DONGGUAN CITY GUANGDONG PROVINCE 523808 DONGGUAN CITY GUANGDONG PROVINCE 523808

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Yong Guangdong, CN 466 3808
XIN, Yujun Guangdong, CN 2 10
XU, Yongjing Guangdong, CN 25 33
ZENG, Xianping Guangdong, CN 29 83

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