LED ENCAPSULANT
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United States of America Patent
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Issued Date -
Sep 1, 2016
app pub date -
Oct 24, 2014
filing date -
Oct 24, 2013
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Abstract
An LED encapsulant comprises a scattering particle mixture, which includes:
- (i) a linear polymer including a dimethylsiloxane group which has a vinyl end substituent and/or a linear polymer including a methylphenylsiloxane group which has a vinyl end substituent; and (ii) at least one vinyl-based resin selected from the group consisting of a vinyl-based ViMQ resin. An LED package comprising the encapsulant is also disclosed.
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