SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
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United States of America Patent
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Sep 1, 2016
app pub date -
Oct 24, 2014
filing date -
Oct 24, 2013
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Abstract
A semiconductor device of the present invention includes a semiconductor layer that has an off-angle inclined in a predetermined off-direction and that is made of a first conductivity type wide bandgap semiconductor at a surface of which a trench is formed, a first electrode bonded to a surface of the semiconductor layer, and a second electrode bonded to a back surface of the semiconductor layer, and when a side surface of the trench is decomposed into a parallel component and a perpendicular component with respect to the off-direction of the semiconductor layer, the parallel component is larger than the perpendicular component.
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