SUPPORT FOR ELECTRONIC POWER COMPONENTS, POWER MODULE PROVIDED WITH SUCH A SUPPORT, AND CORRESPONDING PRODUCTION METHOD
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United States of America Patent
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Issued Date -
Sep 1, 2016
app pub date -
Oct 18, 2013
filing date -
Oct 18, 2013
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Abstract
This substrate for power electronic components comprises a colaminated multilayer composite material containing at least one internal layer (8) made of a material having a thermal expansion coefficient chosen depending on the expansion coefficient of said components, and external layers (6, 7) made of a thermally conductive material covering on either side said internal layer and connected together by wells (P) made of a thermally conductive material, said wells being arranged in the internal layer.
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