SPUTTERING TARGET AND PROCESS FOR PRODUCING IT

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United States of America Patent

SERIAL NO

15033427

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Abstract

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A sputtering target is composed of an Mo alloy containing at least one metal of group 5 of the Periodic Table, where the average content of group 5 metal is from 5 to 15 at % and the Mo content is ≧80 at %. The sputtering target has an average C/O ratio in (at %/at %) of ≧1. The sputtering targets can be produced by shaping or forming and have an improved sputtering behavior.

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Patent Owner(s)

Patent OwnerAddress
PLANSEE SE6600 REUTTE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KNABL, WOLFRAM REUTTE, AT 11 27
REINFRIED, NIKOLAUS LECHASCHAU, AT 3 24
SCHOBER, MICHAEL BREITENWANG, AT 58 342
WINKLER, JOERG REUTTE, AT 14 185

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