Method for generating parameter pattern, ion implantation method and feed forward semiconductor manufacturing method
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United States of America Patent
Stats
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Jul 4, 2017
Grant Date -
Sep 1, 2016
app pub date -
Feb 26, 2015
filing date -
Feb 26, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present disclosure provides a method for generating a parameter pattern including: performing a plurality of measurements upon a plurality of regions on a surface of a workpiece to obtain a plurality of measured results; and deriving a parameter pattern according to the plurality of measured results by a computer; wherein the parameter pattern includes a plurality of regional parameter values corresponding to each of the plurality of regions on the surface of the workpiece. The present disclosure provides a Feed Forward semiconductor manufacturing method including: forming a layer with a desired pattern on a surface of a workpiece; deriving a control signal including a parameter pattern according to spatial dimension measurements against the layer with the desired pattern distributed over a plurality of regions of the surface of the workpiece; and performing an ion implantation on the surface of the workpiece according to the control signal.
First Claim
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International Classification(s)
- 2015 Application Filing Year
- H01J Class
- 2290 Applications Filed
- 1843 Patents Issued To-Date
- 80.49 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01J Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 4, 2029 |
