SEMICONDUCTOR DEVICE, PLATING METHOD, PLATING SYSTEM AND RECORDING MEDIUM
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United States of America Patent
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Aug 25, 2016
app pub date -
Feb 19, 2016
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Feb 23, 2015
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Abstract
Adhesivity between a catalyst adsorption layer on a substrate and a barrier metal plating layer can be improved. The catalyst adsorption layer 22 containing a catalyst metal is formed on the substrate 2 by supplying a catalyst solution onto the substrate 2, and a bonding metal layer 22A containing a bonding metal different from the catalyst metal is formed on the catalyst adsorption layer 22 by performing a plating process with the catalyst metal as a catalyst. A barrier metal plating layer 23 is formed on the bonding metal layer 22A by performing a plating process with the bonding metal as a catalyst.
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