SOLDER BALL FOR FLUXLESS BONDING, METHOD OF MANUFACTURING THE SAME, AND METHOD OF FORMING SOLDER BUMP
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United States of America Patent
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app pub date -
Feb 23, 2016
filing date -
Feb 25, 2015
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Abandoned
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Abstract
A solder ball for fluxless bonding includes a solder core, a first metal layer on a surface of the solder core, and a second metal layer on the first metal layer. The first metal layer includes at least one of nickel (Ni), silver (Ag), zinc (Zn), tin (Sn), chrome (Cr), antimony (Sb), platinum (Pt), palladium (Pd), aluminum (Al), or an alloy thereof. The second metal layer includes gold (Au). As the above solder ball for fluxless bonding is in use, a solder bump having high reliability may be formed via a relatively short, low cost, and simple process.
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