BONDED ASSEMBLY PROVIDED WITH A INTERMEDIATE DEFORMATION LAYER WITH VARIABLE FLEXIBILITY
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United States of America Patent
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Issued Date -
Aug 25, 2016
app pub date -
Oct 20, 2014
filing date -
Oct 21, 2013
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Abstract
A bonded assembly designed for assembling a substrate to a structure or indeed to reinforce a structure. The bonded assembly includes:
- first and second substrates,an intermediate layer rigidly connected to the first substrate, and having flexibility that varies along the first substrate, the variable flexibility resulting from a variation in the thickness of at least one material of the intermediate layer,an adhesive between the intermediate layer and the second substrate.
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