SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Aug 18, 2016
app pub date -
Feb 12, 2016
filing date -
Feb 13, 2015
priority date (Note) -
Abandoned
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Abstract
Provided is a semiconductor device. The semiconductor device includes a second semiconductor pattern disposed on the substrate and configured to provide a channel region, and a first semiconductor pattern disposed between the substrate and the second semiconductor pattern, wherein the first semiconductor pattern includes a channel region that is a portion in contact with the second semiconductor pattern and source/drain regions that are portions exposed by the second semiconductor pattern.
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