PACKAGED SEMICONDUCTOR DEVICES
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United States of America Patent
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Issued Date -
Aug 18, 2016
app pub date -
Sep 4, 2015
filing date -
Feb 17, 2015
priority date (Note) -
Abandoned
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Abstract
A packaged semiconductor device is provided, which includes a substrate comprising a contact pad; a passivation layer disposed on the substrate, where the passivation layer covers part of the contact pad; an under bump metallization (UBM) layer disposed on the substrate, where the UBM layer is coupled to the contact pad; a conductive bump disposed on the UBM layer, where the conductive bump comprises a column connecting the UBM layer and a cap disposed on top of the column; and a solder ball encapsulating the conductive bump. The cap includes a bottom area larger than a cross-sectional area of the column, and a bottom of the cap is distant from an upper surface of the passivation layer by a space.
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