RF Package
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United States of America Patent
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Issued Date -
Aug 18, 2016
app pub date -
Feb 12, 2015
filing date -
Feb 12, 2015
priority date (Note) -
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Abstract
An example package comprising: an RF circuit having a first portion and a second portion; a cavity structure positioned only over the first portion of the RF circuit; and an encapsulant material coupled to cover the RF circuit and cavity structure on at least one side of the RF circuit. An example method of package manufacture, comprising: identifying an RF circuit; forming a cavity structure upon the RF circuit, wherein at least a portion of the cavity structure has a height based on a level of magnetic field in the RF circuit; and covering the RF circuit and cavity structure with an encapsulant material on at least one side of the RF circuit.
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