SUBSTRATE STRUCTURE

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United States of America Patent

APP PUB NO 20160240302A1
SERIAL NO

14981184

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Abstract

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A substrate structure is provided, which includes: a first dielectric layer having a magnetic material; a circuit layer having an inductor circuit and a plurality of conductive traces; and a second dielectric layer bonded to the first dielectric layer and encapsulating the circuit layer. As such, the inductance value of the inductor circuit is increased due to the magnetic material of the first dielectric layer, thereby eliminating the need to increase the number of coils of the inductor circuit.

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Patent Owner(s)

Patent OwnerAddress
SILICONWARE PRECISION INDUSTRIES CO LTDTAICHUNG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Ho-Chuan Taichung, TW 26 46
Lu, Ying-Wei Taichung, TW 11 35
Tsai, Ming-Fan Taichung, TW 20 48

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