Method for producing polyoxymethylene resin composition

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10738166
APP PUB NO 20160237221A1
SERIAL NO

15027084

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Calculated Rating
US Family Size
Non-US Coverage

Abstract

See full text

A polyoxymethylene resin composition from which formaldehyde is generated in a reduced amount upon molding, without carrying out a stabilization treatment for stabilizing an unstable terminal group in a crude oxymethylene copolymer. A hindered phenol-type antioxidant agent and an ethylene-(methacrylic acid) copolymer resin or an ethylene-(acrylic acid) copolymer resin or a salt thereof are melted and kneaded together to produce a polyoxymethylene resin composition without carrying out a stabilization treatment for stabilizing an unstable terminal group in a crude oxymethylene copolymer for which a polymerization catalyst is deactivated after the completion of copolymerization, and in which the unstable terminal group is not yet stabilized. When the polyoxymethylene resin composition is extrusion-molded, the discoloration of a molded product or the deterioration in properties of the molded product can be prevented for a long period of time. The resulting polyoxymethylene resin composition is suitable for forming an extrusion-molded article.

First Claim

See full text

Other Claims data not available

Family

PCTEP
+

Patent Owner(s)

Patent OwnerAddress
POLYPLASTICS CO LTD2-18-1 KONAN MINATO-KU TOKYO 1088280 ?1088280

International Classification(s)

loading....
  • 2014 Application Filing Year
  • C08J Class
  • 1723 Applications Filed
  • 1369 Patents Issued To-Date
  • 79.46 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201420152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Monma, Tomohiro Fuji, JP 18 16
Shimoda, Akihide Fuji, JP 16 61
Watanabe, Kazufumi Fuji, JP 71 1032

Cited Art Landscape

Load Citation

Patent Citation Ranking

  • 0 Citation Count
  • C08J Class
  • 0 % this patent is cited more than
  • 5 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges390209701 - 1011 - 200255075100125150175200225250275300325350375400425

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Feb 11, 2028
11.5 Year Payment $7400.00 $3700.00 $1850.00 Feb 11, 2032