PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Aug 11, 2016
app pub date -
Feb 9, 2016
filing date -
Feb 10, 2015
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Abstract
A printed circuit board, a semiconductor package and a method of manufacturing the same are provided. The printed circuit board includes an insulation layer, an electronic component embedded within the insulation layer, a component guide affixing the embedded electronic component at an installed position, and a circuit layer disposed in the insulation layer.
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