SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING HEAT DISSIPATION ELEMENTS
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United States of America Patent
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Issued Date -
Aug 11, 2016
app pub date -
Sep 9, 2015
filing date -
Feb 6, 2015
priority date (Note) -
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Abstract
A semiconductor package structure includes a flexible substrate, a semiconductor element, a printed circuit board, and first and second heat dissipation elements. The flexible substrate includes first and second insulation layers, and a first wiring layer including input and output ends. The semiconductor element is connected to the first wiring layer. The printed circuit board is disposed adjacent to the input end and includes a second wiring layer connected to the first wiring layer. The first heat dissipation element is connected to the printed circuit board and spaced apart from the second wiring layer. The second heat dissipation element has a main portion and a first extension portion extending to contact the first heat dissipation element.
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