SEMICONDUCTOR DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 11, 2016
app pub date -
Feb 8, 2016
filing date -
Feb 9, 2015
priority date (Note) -
Published
status (Latency Note)
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Abstract
There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD | 491B RIVER VALLEY ROAD VALLEY POINT #12-03 SINGAPORE 248373 |
International Classification(s)

- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
HIROBE, Masao | Yokohama, JP | 3 | 19 |
# of filed Patents : 3 Total Citations : 19 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 19 Citation Count
- H01L Class
- 75.67 % this patent is cited more than
- 9 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 11, 2028 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

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Jul 20, 2018 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MITSUBISHI HEAVY INDUSTRIES, LTD.;REEL/FRAME:046499/0613 Owner name: MITSUBISHI HEAVY INDUSTRIES ENGINEERING, LTD., JAPAN Effective Date: Jul 20, 2018 free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MITSUBISHI HEAVY INDUSTRIES, LTD.;REEL/FRAME:046499/0613 Owner name: MITSUBISHI HEAVY INDUSTRIES ENGINEERING, LTD., JAP Effective Date: Jul 20, 2018 |
Sep 28, 2017 | P | Published | |
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Mar 09, 2017 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KIMURA, KEISUKE;MASUMORI, KENTA;SHINOKI, FUJIO;AND OTHERS;REEL/FRAME:041571/0697 Owner name: MITSUBISHI HEAVY INDUSTRIES, LTD., JAPAN Effective Date: Mar 09, 2017 |
Sep 08, 2015 | F | Filing | |
Sep 22, 2014 | PD | Priority Date |

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