CHAMBERS FOR PARTICLE REDUCTION IN SUBSTRATE PROCESSING SYSTEMS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 11, 2016
app pub date -
Feb 5, 2015
filing date -
Feb 5, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A substrate processing system includes a chamber configured to process a semiconductor substrate. At least one surface of the chamber includes a high surface area finish. A purge/vent system is configured to selectively supply purge gas over the high surface area finish of the at least one surface to trap particles in the high surface area finish without opening the chamber. The high surface area finish on the at least one surface of the chamber has a porosity within a predetermined range from 30-60%. The porosity is defined by a normalized density of the high surface area finish relative to an underlying native bulk material of the at least one surface of the chamber.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully