SPECIMEN TESTING PACKAGE
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United States of America Patent
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Issued Date -
Aug 11, 2016
app pub date -
Feb 4, 2016
filing date -
Feb 6, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A specimen testing package includes a sensor chip provided in its front face with a fixing region of a reactant selectively reacting with a specimen contained in a specimen solution, a substrate to which a back face of the sensor chip is fixed, an external connection lead electrically connected to the sensor chip via a wire, an insulator provided in the substrate for insulating the wire from the outside, and a surrounding wall surrounding the fixing region in form of a continuous loop.
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