METHOD FOR PRODUCING A METAL-CERAMIC SOLDERED CONNECTION

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United States of America Patent

SERIAL NO

15025339

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Abstract

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A method for producing a material-bonding metal-ceramic soldered connection of an uncoated ceramic body to a metal part uses a metallic solder and begins by choosing the metal part with a 50% fraction of an oxygen-affine element; choosing the ceramic body with at least 80% aluminum oxide, zirconium oxide, silicon oxide or an alloy thereof; choosing an inactive, eutectic or near-eutectic solder; and forming a structure with the ceramic body and the metal part with an intermediate space between the their opposing surfaces. The solder is introduced into the intermediate space or the vicinity thereof. The structure is heated in a vacuum at a soldering temperature (T) greater than the liquidus temperature (TL) of the solder for a soldering period. The connection is applied between a ceramic bushing and a high-temperature sensor.

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Patent Owner(s)

Patent OwnerAddress
KISTLER HOLDING AGWINTERTHUR SWITZERLAND WINTERTHUR ZURICH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MÄRKI, HANS-BEAT KOLLBRUNN, CH 1 1
MASTROGIACOMO, GIOVANNI ZURICH, CH 6 6

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