COATED FILMS FOR CIRCUIT BOARDS
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United States of America Patent
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Aug 4, 2016
app pub date -
Dec 30, 2015
filing date -
Dec 31, 2014
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The present disclosure is directed to composite films, such as subcomponents of a circuit board assembly including a non-meltprocessable fluoropolymer layer and a melt processable fluoropolymer layer having an average thickness in a range of from 0.1 microns to 20 microns. When included within a printed circuit board, the composite can exhibit greater resistance to delamination.
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