LED Packaging Structure And Method For Manufacturing The Same
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United States of America Patent
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Issued Date -
Aug 4, 2016
app pub date -
Feb 3, 2016
filing date -
Feb 4, 2015
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Abstract
An LED package having a substrate, an LED chip, a phosphor sheet and a first resin is provided. The LED chip is disposed on the substrate. The phosphor sheet has a first area, and is affixed on a first surface of the LED chip. The first resin is disposed on the substrate for covering the LED chip along with the phosphor sheet, with at least a part of the phosphor sheet being exposed.
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