Low density polishing pad
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United States of America Patent
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Mar 16, 2021
Grant Date -
Aug 4, 2016
app pub date -
Jan 30, 2015
filing date -
Jan 30, 2015
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Abstract
Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.
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