THERMOELECTRIC-COOLING-CHIP-BASED HEAT-DISSPATING SYSTEM
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United States of America Patent
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Issued Date -
Jul 28, 2016
app pub date -
Jun 2, 2015
filing date -
Jun 2, 2015
priority date (Note) -
Abandoned
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Abstract
A thermoelectric-cooling-chip-based heat-dissipating system includes a partition board; a thermoelectric cooling chip having a hot side and a cold side located at two opposite sides of the partition board; a cool-air zone containing an air passage, a first fan, and a first heatsink set, wherein the first heatsink set is deposited on the cold side of the thermoelectric cooling chip, and the first fan and the first heatsink set are located in the air passage, so that the first fan blows air around the first heatsink set to move along the air passage; and a heat-dissipating zone containing a second fan and a second heatsink set, wherein the second fan blows air toward the second heatsink set, and the second heatsink set is deposited on the hot side of the thermoelectric cooling chip; wherein, the cool-air zone and the heat-dissipating zone are isolated from each other.
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