ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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N/A
Issued Date -
Jul 28, 2016
app pub date -
Jan 21, 2016
filing date -
Jan 22, 2015
priority date (Note) -
Abandoned
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Abstract
An electronic component embedded printed circuit board and method thereof a first insulation layer, an electronic component, a second insulation layer, and a circuit layer. The first insulation layer includes a trench formed therein. The electronic component is installed in the trench. The second insulation layer is formed above the first insulation layer and the electronic component. The circuit layer is formed on the first insulation layer and on the second insulation layer.
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