WIRING BOARD
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United States of America Patent
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Issued Date -
Jul 28, 2016
app pub date -
Jan 20, 2016
filing date -
Jan 26, 2015
priority date (Note) -
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Abstract
A wiring board of the present invention includes a build-up layer having a plurality of insulating layers laminated one upon another, a groove formed on a major surface of each of the insulating layers, and a wiring conductor formed in the groove. A surface of the wiring conductor lies lower than the major surface of each of the insulating layers which is formed in the wiring conductor in the groove.
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