WIRING BOARD
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United States of America Patent
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Issued Date -
Jul 28, 2016
app pub date -
Jan 20, 2016
filing date -
Jan 20, 2016
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wiring board of the present invention includes a core substrate, insulating layers laminated on upper and lower surfaces of the core substrate, and a conductor layer deposited on the upper and lower surfaces of the core substrate and a surface of each of the insulating layers, in such a manner as to make a difference in area occupation ratio between the upper and lower surfaces of the core substrate. A thickness of a conductor that has a large area occupation ratio is smaller than a thickness of a conductor that has a small area occupation ratio between the conductor layers deposited on the upper and lower surfaces of the core substrate, and between the conductor layers deposited on the surface of each of the insulating layers laminated at an identical level on upper and lower surface sides with the core substrate as a center.
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