SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY

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United States of America Patent

APP PUB NO 20160218088A1
SERIAL NO

15086693

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Importance

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Abstract

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Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.

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Patent Owner(s)

Patent OwnerAddress
INVENSAS CORPORATION2702 ORCHARD PARKWAY SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Andrews,, JR Lawrence Douglas Scotts Valley, US 12 415
McElrea, Simon J S Scotts Valley, US 17 382
Robinson, Marc E San Jose, US 16 669

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