HEAT SINK MODULE AND SIPHON HEAT SINK THEREOF
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United States of America Patent
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Issued Date -
Jul 28, 2016
app pub date -
Dec 3, 2015
filing date -
Dec 3, 2015
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Abstract
A heat sink module and its siphon heat sink includes a transverse pipe member, a tilt pipe member, a first vertical pipe, second vertical pipes, fins, and a working fluid. The tilt pipe member having a low section and a high section is installed at the top of the transverse pipe member. Both ends of the first vertical pipe are coupled and communicated to the transverse pipe member and the low section respectively. Both ends of each second vertical pipe are coupled and communicated to the transverse pipe member and the high section respectively. The transverse pipe member, tilt pipe member, first vertical pipe and second vertical pipes jointly form a return pipeline. Each fin is coupled to the second vertical pipe. The working fluid is filled in the return pipeline. Therefore, the effects of separating gas and liquid channels and improving the heat dissipating efficiency can be achieved.
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