Conductive Composite Materials Containing Multi-Scale High Conductive Particles and Methods

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United States of America Patent

SERIAL NO

14456889

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Abstract

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Composite materials are provided that include a host material, nanoscale high conductive particles, and microscale high conductive particles. The nanoscale high conductive particles and the microscale high conductive particles may increase the through thickness thermal conductivity of the composite material by at least 4.0 W/(m·K), as compared to the same composite material without the nanoscale high conductive particles and microscale high conductive particles. Methods for making the composite materials herein also are provided.

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Patent Owner(s)

Patent OwnerAddress
FLORIDA STATE UNIVERSITY RESEARCH FOUNDATION INC2000 LEVY AVENUE BUILDING A SUITE 351 TALLAHASSEE FL 32310

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liang, Zhiyong (Richard) Tallahassee, US 2 2
Wang, Shaokai Tallahassee, US 4 3

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